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Home > Products > GaN Epitaxial Wafer > RF GaN on HR Si Epi Wafer Supplier

RF GaN on HR Si Epi Wafer Supplier

GaN-On-Si Epi Wafer For RF HEMT
Substrate Diameter:6 inch (111)
Substrate Thickness:1000um
Epi Layer Total Thickness: 1.5~2.0um

Product Description

As the leading manufacturer and supplier of GaN Epi Wafer, Homray Material Technology offers 2inch 4inch 6 inch and 8inch RF GaN on Si Epitaxy Wafers. The HEMT RF product is a state-of-the-art (Al,Ga)N/GaN heteroepitaxial layer structure deposited crack-free on a (111) high resistance Si-wafer for RF power applications. Homray Material Technology offers two standard HEMT structures: one having an Al0.25Ga0.75N barrier without an AlN spacer layer and the other one having an Al0.25Ga0.75N barrier with an AlN spacer layer. Custom barrier, cap layer and in-situ SiN designs are available upon request.

The epitaxial layer consists of an active heterostructure based on an AlGaN layer and a GaN channel, providing high electron mobility and low sheet resistivity.
The proprietary high-voltage buffer design offers low leakage currents, high breakdown voltage, low dispersion and a consistently low wafer bow.

Standard Layer Specification For RF HEMT
Please contact us for Power HEMT detailed structure.



Characterization Specifications



Standard Layer Structure for RF HEMT                  GaN Epi Wafer Picture

 
 

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M.P: +86-15366208370 ; +86-15366203573
E-mail: kim@homray-material.com;tina@homray-material.com
HMT Silicon Carbide (SiC) Wafer Website: www.sicwafer-hmt.com